The main application of this device in integrated circuits, discrete devices, power electronic devices melting welding production, diffusion, sintering, heat treatment and annealing process of.
The main technical indicators:
Methods: heating vertical, ring wall, bell jar lifting type, screw conveyor feeding, automatic feeding, vacuum chamber is equipped with a workpiece support
Can handle wafer size: 2-8 inch
Constant temperature zone length: 400-800mm
Working temperature: 400-1250 degree.
Temperature control accuracy of ± 1 degrees:
The effective working space: s 350* high 700mm; (the size can be made according to the process requirements)
The vacuum unit: using 2x-8 mechanical pump and turbo molecular pump (or diffusion pump)
Vacuum: the ultimate vacuum 5*10-4.
Process gas: N2/H2/Ar/O2 (optional according to process requirements);
Pressure: 0.02 - 0.2MPa
Cooling water pressure: 0.2 - 0.4MPa
The power supply voltage: 380V; total power: 22KW
Function characteristics:
All Chinese Windows interface, can edit the parameters, convenient operation.
★ can save a plurality of process curve, each curve can be set step. Automatic operation control function
★ process curve. Making
★ automatic operation can pause / continue running function.
★ process can be forced to jump to the next process step function. Making
★ intelligent temperature gradient function.
★ PID parameters self-tuning function.
★ system failure detection and alarm function .
★ blackouts breakpoint resume operation function.
★ process gas program control (electromagnetic valve / mass flow controller).
★ according to the special requirements of users increase or decrease the corresponding function.